Modulushca was present at the second edition of the Conference about Intelligent Mobility in Lille who performed the ATEC ITS France in collaborative partnership with CCI Grand Lille.
MODULUSHCA is going to be part of the Empack fair in Madrid. Empack is an important point of meeting where annually is offered and demanded different innovations of packaging.
This fair will take part in Madrid the 5th of November and the European project Modulushca will present their innovation for the logistics operations.
MODULUSHCA was present at Interpack last may 2014, in ITENE's booth. Interpack is the most important packaging trade fair in the world and takes place in Düsseldorf (Germany) every three years. The attendance to the event was succesfull: there were 175.000 visitors coming from 120 countries.
The project addresses the recently introduced Physical Internet vision (PI), which proposes to use a new framework of interconnected logistics especially designed for open resource sharing, notably thanks to open standard on load units, real time identification and routing through open facilities.
The aim of the project is to enable operating with developed iso-modular logistics units of sizes adequate for real modal and co-modal flows of fast-moving consumer goods (FMCG), providing a basis for an interconnected logistics system for 2030
Many of these visitors were interested in the Modulushca project, which is being developed by a consortium composed of 15 organizations.
In the next picture you can see Máximo Martínez (Procter&Gamble) and Juan Alcaraz (ITENE).
The Project Team will keep to all the stakeholders and interested parties update of all of the project's advances with this material.
Please, feel free to share this article with anyone you consider could be interested in this project.